Power Driver Modules

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of 1.103

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Configuration	Current	Voltage	Voltage - Isolation	Grade	Qualification	Mounting Type	Package / Case
FDMF5062 SMART POWER STAGE 70A 39PQFN onsemi	3.034 In Stock	1 : 4,34000 € Cut Tape (CT) 3.000 : 1,59508 € Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	1 Phase	70 A	30 V	-	-	-	Surface Mount	39-PowerVFQFN
NV6128 GANFAST SINGLE, 650V, 70MOHMS, P Navitas Semiconductor, Inc.	3.129 In Stock	1 : 7,42000 € Cut Tape (CT) 5.000 : 4,24986 € Tape & Reel (TR)	GaNFast™	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge	20 A	650 V	-	-	-	Surface Mount	30-PowerVQFN
IKCM30F60GAXKMA1 IFPS MODULE 600V 30A 24PWRDIP Infineon Technologies	109 In Stock	1 : 14,19000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	30 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
FSBB20CH60C MODULE SPM 600V 20A 27PWRDIP onsemi	260 In Stock	1 : 19,44000 € Tube	Motion SPM® 3	Tube	Not For New Designs	IGBT	3 Phase	20 A	600 V	2500Vrms	-	-	Through Hole	27-PowerDIP Module (1.205", 30.60mm)
STK541UC62K-E MOD IPM 600V 10A 23PWRSIP onsemi	160 In Stock	1 : 20,12000 € Tube	-	Tube	Not For New Designs	IGBT	3 Phase	10 A	600 V	2000Vrms	-	-	Through Hole	23-PowerSIP Module, 19 Leads, Formed Leads
LMG3522R030RQSR 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	1.454 In Stock	1 : 22,29000 € Cut Tape (CT) 2.000 : 11,16105 € Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount	52-VQFN Exposed Pad
LMG3522R030QRQSTQ1 AUTOMOTIVE 650-V 30-M GAN FET WI Texas Instruments	176 In Stock	1 : 30,63000 € Cut Tape (CT) 250 : 21,12904 € Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	Automotive	AEC-Q100	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
IM818LCCXKMA1 CIPOS MAXI 1200V 15A PG-MDIP-24 Infineon Technologies	291 In Stock	1 : 31,68000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase Inverter	20 A	1.2 kV	2500Vrms	-	-	Through Hole	24-PowerDIP Module (1.094", 27.80mm)
IM828XCCXKMA1 CIPOS MAXI 1200V 35A PG-MDIP-24 Infineon Technologies	164 In Stock	1 : 74,69000 € Tube	CIPOS™	Tube	Active	MOSFET	3 Phase Inverter	35 A	1.2 kV	2500Vrms	-	-	Through Hole	24-PowerDIP Module (1.094", 27.80mm)
NV6127 IC PWR GANFAST N-CH 1:1 30QFN Navitas Semiconductor, Inc.	3.830 In Stock	1 : 5,07000 € Cut Tape (CT) 5.000 : 2,64235 € Tape & Reel (TR)	GaNFast™	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge	12 A	650 V	-	-	-	Surface Mount	30-PowerVQFN
IGCM10F60GAXKMA1 IGBT 600V 24MDIP Infineon Technologies	162 In Stock	1 : 9,01000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	10 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IKCM15H60GAXKMA2 IFPS MODULES 24MDIP Infineon Technologies	554 In Stock	1 : 9,10000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	15 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IKCM15F60GAXKMA1 IFPS MODULES Infineon Technologies	191 In Stock	1 : 10,08000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	15 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IGCM20F60GAXKMA1 IGBT 600V 20A 24PWRDIP MOD Infineon Technologies	279 In Stock	1 : 11,69000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	20 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
FNB41560 MODULE SPM 600V 15A 26PWRDIP onsemi	212 In Stock	1 : 13,24000 € Tube	Motion SPM® 45	Tube	Not For New Designs	IGBT	3 Phase	15 A	600 V	2000Vrms	-	-	Through Hole	26-PowerDIP Module (1.024", 26.00mm)
IKCM20L60GDXKMA1 IFPS MODULE 600V 20A 24PWRDIP Infineon Technologies	184 In Stock	1 : 13,53000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	20 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IKCM20R60GDXKMA1 IFPS MODULE 600V 20A 24PWRDIP Infineon Technologies	180 In Stock	1 : 14,20000 € Tube	CIPOS™	Tube	Active	IGBT	2 Phase	20 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IKCM30F60GDXKMA1 IFPS MODULE 600V 30A 24PWRDIP Infineon Technologies	208 In Stock	1 : 15,80000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase	30 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IM564X6DXKMA1 PFC INTEGRATED IPM Infineon Technologies	121 In Stock	1 : 17,60000 € Tube	CIPOS™	Tube	Active	MOSFET	3 Phase Inverter	20 A	600 V	2000Vrms	-	-	Through Hole	24-PowerDIP Module (1.028", 26.10mm)
IM12B20EC1XKMA1 IM12B20EC1XKMA1 Infineon Technologies	245 In Stock	1 : 36,51000 € Tube	CIPOS™	Tube	Active	IGBT	3 Phase Inverter	30 A	1.2 kV	2500Vrms	-	-	Through Hole	24-PowerDIP Module (1.094", 27.80mm)
FNA25060 MOD SPM 600V 50A SPMCA-A34 onsemi	36 In Stock 18.984 Factory	1 : 57,75000 € Tube	Motion SPM® 2	Tube	Active	IGBT	3 Phase	50 A	600 V	2500Vrms	-	-	Through Hole	34-PowerDIP Module (1.480", 37.60mm)
AOZ5507QI_2 25V/30A 5X5 DRMOS POWER MODULE Alpha & Omega Semiconductor Inc.	8.700 In Stock	1 : 2,22000 € Cut Tape (CT) 5.000 : 0,63910 € Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	1 Phase	30 A	-	-	-	-	Surface Mount	22-PowerVFQFN Module
NV6115 IC PWR GANFAST N-CH 1:1 8QFN Navitas Semiconductor, Inc.	948 In Stock	1 : 3,45000 € Cut Tape (CT) 5.000 : 1,71860 € Tape & Reel (TR)	GaNFast™	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge	8 A	650 V	-	-	-	Surface Mount	8-PowerVDFN
NV6117 IC PWR GANFAST N-CH 1:1 8QFN Navitas Semiconductor, Inc.	925 In Stock	1 : 5,07000 € Cut Tape (CT) 5.000 : 2,64235 € Tape & Reel (TR)	GaNFast™	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge	12 A	650 V	-	-	-	Surface Mount	8-PowerVDFN
FSB70250 MODULE SPM 500V 3.3A 27PWRLQFN onsemi	961 In Stock 51.000 Factory	1 : 6,16000 € Cut Tape (CT) 1.000 : 2,54847 € Tape & Reel (TR)	Motion SPM® 7	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	3 Phase	3.3 A	500 V	1500Vrms	-	-	Surface Mount	27-PowerLQFN Module

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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.