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- The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®. Bergquist also manufactures one and two layer Thermal Clad®, IMS® (Insulated Metal Substrate) Thermal Clad® HT and Thermal Clad®LTI, thermal management substrates for high power surface mount applications. Bergquist is the global source for the processing of Thermal Clad®, IMS® circuits.
Gap Pad HC 5.0
A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.
Sil-Pad® 900S
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
Q-Pad® 3
Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.
Gap Pad® 1500
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
Sil-Pad® K-10
The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.
Gap Pad® VO Ultra Soft
Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
Gap Pad EMI 1
Duration: 15 minutes
Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft
Duration: 5 minutes
Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics
Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.
Thermal Interface Materials (TIM) Gap Pad
An electrically isolating material which provides protection between heat sinks and high voltage devices.
Liquid Dispensed TIM
This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.
Publish Date: 2015-06-19