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Image of Octavo OSDZU3-REF Development Platform OSDZU3-REF Development Platform for the OSDZU3 System In Package (SiP) Publish Date: 2025-06-23

The Octavo OSDZU3-REF is a powerful development and evaluation platform for the OSDZU3 system in package (SiP).

Image of Octavo Systems OSD62x SiP based on the TI AM62
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OSD62x System in Package Based on the TI AM62 Publish Date: 2025-06-23

The Octavo Systems OSD62x SiP integrates the TI AM62 processor with DDR4 memory, TPS65219 PMIC, EEPROM, oscillators, and passives into a 21 mm x 21 mm BGA pkg.

Image of Octavo's OSD32MP15x SiP OSD32MP15x System-in-Package (SiP) Updated: 2020-07-02

Octavo's OSD32MP15 is a system-in-package (SiP) featuring STMicroelectronics' STM32MP15 MPU for increased reliability through a reduced number of components.

Image of Octavo's OSD335x C-SiP OSD335x C-SiP Family Updated: 2020-03-10

Octavo System's OSD335x C-SiP system-in-package (SiP) is a self-contained computing system ideal to power the latest embedded applications.

Image of OSD335x-SM System-in-Package (SiP) Family - Octavo Systems OSD335x-SM System-in-Package (SiP) Family Publish Date: 2017-09-18

Octavo Systems' OSD335x-SM is the perfect solution for the designer that is looking for the most flexible Arm®-based solution in the smallest footprint.

OSD335x System-in-Package (SiP) Family - Octavo Systems OSD335x System-in-Package (SiP) Family Publish Date: 2016-05-18

Octavo Systems' OSD335x family of SiP products are designed to allow implementation of systems based on Texas Instruments’ Sitara™ AM335x line of processors.